51. Forming Via Holes in A Multilevel Substrate in a Single Step
Inventor(s): Nalin Kumar
Patent # 5,227,013 Filed 7/25/91 Issued 7/13/93
52. Field Emitter Device With Diamond Emission Tips
Inventor (s): Nalin Kumar
Patent # 5,199,918 Filed: 11/7/91 Issued: 4/6/93
53. Applying A Compound Of A Metal And A Gas Onto A Surface
Inventor(s): Nalin Kumar
Patent # 5,196,102 Filed 8/8/91 Issued 3/23/93
54. Cylindrical Hollow Cathode Magnetron Sputtering System
Inventor(s): Nalin Kumar
Patent # 5,178,743 Filed 1/30/91 Issued 1/12/93
55. Diffusion Barrier For Copper Features
Inventor(s): Nalin Kumar
Patent # 5,164,332 Filed 3/15/91 Issued 11 /17/92
56. Semiconductor Bonding Bumps Using Metal Cluster Ion Deposition
Inventor(s): Nalin Kumar, Rao Goruganthu and Mohammed Ghazi
Patent # 5,156,997 Filed 2/11/91 Issued 10/20/92
57. Electrical Components in High Density Substrates
Inventor(s): Nalin Kumar
Patent # 5,120,572 Filed 10/30/90 Issued 06/09/92
58. Multilayer Electrical Interconnect Fabrication, Few Process Steps
Inventor(s): Nalin Kumar and Charles Lin
Patent # 5,118,385 Filed 05/28/91 Issued 06/02/92
